????????????????·???????????????????????????????“?????????·??????????”???????????????????????????????????????????????????????????????????????·???????????????????????????,?????????????????????????????????о?????IMEC????2016??3??17??-19??????????????“????????????????????”????????????????????????Altera???????????з?????????John Y. Xie?????Ρ?

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??д????????????????????????WangYi@MEMSConsulting.com????????????????????????????????????????????????????+??λ????+??????

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This class will discuss semiconductor industry faced Moore’s law challenge today, the rising cost of silicon scaling, the system integration challenge and advanced memory need. It will provide the insides of 3DIC and advanced stacked die packaging and integration technologies.It will discuss a full suite of tiered advanced stacked die packaging integration technology varieties ranging from density, cost, configuration and form factors. It will include, e.g., 3D IC stacking techniques; 2.5D stacking solution using silicon interposer with TSV; 2.5D stacking with silicon bridge without TSV; 2.5D- stacking using organic interposer; 2.1D stacking using high or ultra-high density organic technology; 2.1D+ high density and cost effective stacking technology using wafer level fanout technology; 2.1D- panel level fanout low cost multi-die small form factor packaging; F2F (3D-) high density and low cost stacking solution; Glass interposer and its application potential, etc. The latest industry ecosystem development status and key player’s technology innovations will also be discussed. Advanced co-design and co-architecture concept, SIPI considerations and EDA tool status will also be touched.

???γ???????????????????????????????????????????????????????????????????????????3D IC????????????????????????????????????????????????????????????????????????Χ????????????????????????????????3D?????·????????????ù??н????TSV??2.5D??????????; 2.5D????????TSV????????ù?弼????2.5D-?????????????????л???????2.1D???; ???t?????????????2.1D +???????????????????? 2.1D-?弶???????????С???η???? F2F??3D-?????????????????????????н???????????????γ??????????????????????????????????????????￡?????????漰???Э?????????????SIPI????????EDA???????????

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л???????Dr. John Yuanlin Xie??

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Altera????????Intel???????

л???????Altera???????17????Altera????????з??????????????????????з??????????????????????????2??????2.5D/3DIC???????????????????????????????????л????????Altera?????17???У??????????Altera?????????о?BGA?????????????????????Altera?????????????????????????????????????????￡??????????缶??????????γ????IC-PKGЭ????????????????????????????Altera???????????????????з?????? Altera??????λ???????????У????1984?????????????????????????????? Altera??????????????????????????????????????? Altera??20?????????3000???????????????????????????????????????????а?????FPGA??SoCs??CPLDs????????????Altera?????????????????????

????Altera????л?????Prolinx Labs.??λ??????????????????5???????????????Prolinx Labs???????й?????????MfVia???????з???Prolinx Labs??????Micro-filled Via (MfVia)??????Viper Ball Grid Array??ViperBGA???????????BGA????????????Prolinx Labs???????? Copper-Core Ball Grid Array??C2BGA???????????????????? Plastic Ball Grid Array ??PBGA???????????????BGA???????Prolinx Labs??л???????????е?MfVia??????ī????????й????壬??????????????á??????????????????????????????????????????????????????????????

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л???????????????????????????п???????о??????????????λ????????????????????У??????????????????????????ò?????λ???????о???????????III-V????????????????????????з?????????????????????

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