?????????
??????????????????
Teledyne DALSA Semiconductor
?綽: +1 450-534-2321 ???.1220
18, boul. de l'Aéroport, Bromont, QC, Canada , J2L 1S7

???????TSV??????????(WLP)??3D????MEMS

Teledyne DALSA??????????????MEMS?????CMOS?????CCD ????????????????????о??????o??????????????????????????????????????????????????????????????????????????

Teledyne DALSA???????????MEMS????????????????????MEMS???????????鲼???????????????????ú????????????????????????????????г????

???????????????MEMS?????MOEMS????????????????????????MEMS???硢???????????????MEMS?????MEMS????????????HV ASIC??????MEMS??HV Driver IC????????8???6?綼??п??????????????????????????

???????????MEMS????г???????????????????????????????????MEMS???????????????????????MEMS????????????г????????????????????????????г????????????????????????MEMS?????????????????????????г??????????????????г????????MEMS???????????????????????????????????????????????MEMS??о???硢??????????????????MEMS?????????????????????????г?????????MEMS????????????????????????????????

MEMS???????????????Щ??????

?????MEMS?????????????????????MEMS ???????????????????????????MEMS????г?????????????????δ?????????????????????????????????????????????Wafer Level Packaging???????????????MEMS??ASIC??3D?????

?????3D??????и?С??????????????????????????????????????????????????е?????????????????????о??????????

Teledyne Dalsa??????????????????ж????????飬????????????????·????????磬??? MEMS ?? CMOS ????????3D??????????Щ???檔????? 3D ????????????????????飬????????????????????????Teledyne DALSA ????????????????????????

????????Щ??????????200mm Inertial Sensor?????????????????????????????????

???????????Щ?????????Teledyne DALSA??????

Teledyne DALSA????????????????????????????????????????????????????

????????????????????????????????????????????DRIE??1:1 ???????????????? 875 µm????????????? 40 µm/min???????/???????????????????????? TSV ???????棬????????????λ?????????軥??TSV??????? DRIE ??????????? 23:1 ?????? 90-91° ???????????? 9 µm/min??????????????<90 nm??????????? 35:1 ?????????????????????89.7-90.3°?? ????б???<0.5°????????????????????? 60°???????????????????????????????????????????????????

?1 ?????????????DRIE??

?????????е????HF????????????????????????????????SiN???????????????(??е??? = 175 MPa, ??????>4.8 MV/cm)?????????HF??????????????????????????????????????????????????

?2 ???HF?????????????????????????

?3 ?????SiN

??е??? = 175 MPa????????>4.8 MV/cm

?4 ?λ????????ISDP

?????? 0.65 µOhm•cm
ISDP ??? = -25 MPa
?仯?? = 3.0 Mpa/µm

?5 ??????(??????<40 µm; ???? 5:1??1?? 2 µm ????)

?6 ???? SiO22??PECVD??SOG

???? SiO2?? 300 nm – 1 µm
PECVD?? 100 nm – 10 µm
FH??????
SOG?? 100 nm to 2.0 µm????????????

?????????????????????????????ж?????????????????????????? Si-Si??Si-SiO2??SiO2-SiO2???????????????????????????????????????????????????????????????

?7 ???????

?8 ???????

AlCu??AlSiCu??Ti/TiN??Ge??Cu??Ni??Pd??W ??????
????????????????????

?9 ??????и?

????????30 µm
??????????
??е???????и????趥????

??????е????????仹???????????????? Ni/Pd UBM????CMP????????????и??????????????????????????????????????????????????????????????????????????????

??????????Wafer Level Packaging????3D????MEMS

TSV??3D????MEMS?????????????TSV??????“Via-First”????“Via-Last”??????????????????????“Via-First”TSV????Bonding???????????????????￡???“Via-Last”TSV????????Bonding?????????????????????У??????????CMOS??

Teledyne DALSA ??Via-First TSV???????????ù??????in-situ doped poly?λ??????裩??????壬??????????????????? MEMSо????????????????????????????????????????150mm??200mm????????????????????????

?10 ?λ??????????乵??

???????????200mm?????Teledyne DALSA ??Via-First TSV??????????????????????????????Alchimer????μ緋??????ü???????????5????????100??????????????????????????????Ni / Au UBM?????????????????

?11 5μm ???乵

???乤???跡?????????????????????????????????????????е?Via-First???跡?λ??????????乤???430 µm ???????跡< 1 Ohm??????< 10 pF?????????????????????乤?????????????????? Bosch DRIE ???????????????????? DRIE ?????????? 50%??

?12 ?????

Teledyne DALSA???????????TSV??????????????????MEMS??ASIC???????????????3D?????????????????ü????????????MEMS???????????????????TSV?????????????MEMS???????????????????????????Teledyne??????3.4??????????????????????? Teledyne Dalsa????????????????????????????????TSV?????????????????????????????????????????

Teledyne DALSA???????? 3D ???????????t???????????С???????????粢????????????????????????? Teledyne DALSA ????? I/O ?????????????????? µBGA?????????????????????????????????????????????????????????????????????????????????????????????

?13??????????Wafer Level Packaging??

???MEMS?????????????????????????????????????????????????????????????????????????ó????

?????????????????????????????????http://teledynedalsa.com/semi/Home.aspx?lang=CN
?????????????????http://teledynedalsa.com/semi/contact/contact.aspx