????
1??????δ?????????
2??????????MEMS??????
3????????MEMS????????
4??MEMS????????????????????????????
5??200mm??150mm MEMS????????
6?????????????????????

1. ????δ?????????

Teledyne DALSA ??????????????MEMS????????????

????????????????????????????????????????????????й?????е????????????????? ?????????????о??????o??????????????????飬???????????MEMS????????????????????MEMS?????????????????????????????????????????????? ???????????????:????????????????????????????????????

?????????Teledyne DALSA ??????????????齫????????????????????????? ??????????е?????????????????????????????и????????????????????????????

Teledyne DALSA????????????????????????????к????MEMS???????????????к???????MEMS???????????????????????????????????Teledyne DALSA???????????MEMS????ASIC??????????????????????????????????MEMS??÷????????????

?????ISO/TS 16949????????????????????????????????????????????????????

2. ????????MEMS??????

Teledyne DALSA??????????????????????????ù??????????????????????????????????????????Щ?????????????????????????????????????????

???????????????????????????: ????????????????DRIE??????1:1????????????????????875µm?????????????35µm/min?? ???????軥?????????DRIE???????????23:1??????90-91° ????????????9µm/min??????????????<90nm???????????35:1????????????????????(89.7-90.3°) ????б???<0.5°????????????????????????60°???????????????????????????????????????????????????

?????/????????????????????????TSV???????棬????????????λ?????????????HF???????????????????????????

?????SiN????????????????????????HF????????????????????????????????????????????????????????????????????????????????????????3???????????????????????????????????

??????е????????仹????????????????Ni/Pd UBM????CMP????????????и ???????????????????????????????????????????????????????????????????????????????????????????????????????????ж??????????????????????????Si-Si??Si-SiO??SiO-SiO???????????????????????????????????????????????????????????????

??????????????????????????????????????????ù???????????? ???????????Teledyne DALSA?????????????????????ú? ?????????????????????????MEMS?????????????????潫????????????????MEMS??????

?????????????DRIE??
* ???????? (40 µm/min)
* ?????875 µm, ????????
* б????????? (???? 60°)

???HF???
* ??????????????????

?????SiN
* ??е??? = 175 MPa
* ?????? > 4.8 MV/cma

?λ????????ISDP
* ?跡 0.65 µOhm•cm
* ISDP ??? = -25 MPa
* ?????? = 3.0 Mpa/µm

??????
* ?????: <40 µm
* ????: ???? 5:1, 1 µm ????

???? SiO2, PECVD, SOG
* ???? SiO2: 300 nm – 1 µm
* PECVD: 100 nm – 10 µm
* HF ??????
* SOG: 100 nm to 2.0 µm; HF???????

???????
* Si-Si, Si-SiO2, SiO2-SiO2, ???, ????, ?????, ???????, ???????, ?????????, ??????????

???????
* AlCu, AlSiCu, Ti/TiN, Ge, Cu, Ni, Pd, W, ??????
* ????????????????????

??????и?
* ?????? 30 µm
* ????????
* ??е???????и? ???趥????

3. ??????MEMS????????

Teledyne DALSA ?????????????????????????????Щ???????????????·??С??????? ????????·???MEMS??CMOS??????????к???й?????????????3D???????????? ?????????????????軥???????????????Teledyne DALSA ?????????????????????????

TSV??3D????MEMS?????????????TSV??????“Via-First”????“Via-Last”??????????????????????“Via-First”TSV????Bonding???????????????????￡???“Via-Last”TSV????????Bonding?????????????????????У??????????CMOS??

TSV - Teledyne DALSA ?????????????????? TSV????? > 400 µm)???????С??????????????????????/????????????? ?????????“?????”???? ????????????????????乤????跡???????????????????????????????????????????е????????跡 ISDP ??乤???430µm???????跡 < 1 Ohm?????? < 10 pF???? ???????????乤?????????????????? Bosch DRIE???????????????????? DRIE ??????????50%??

Teledyne DALSA ??Via-First TSV???????????ù??????in-situ doped poly?λ??????裩??????壬??????????????????MEMSо????????????????????????????????????????150mm??200mm????????????????????????

??200mm?????????Teledyne DALSA ??Via-First TSV??????????????????????????????Alchimer????μ緋??????ü???????????5????????100??????????????????????????????Ni / Au UBM?????????????????

???????100µm ??????????????????

?λ??????????乵??

???????5um???乵

????????Wafer Level Packaging (WLP)

????????? 3D IC????t???????????С???????????磬??????????????????????????? Teledyne DALSA ?????I/O ?????????????????? µBGA?????????????????????????????????????????????????????????????????????????SI ???????????????????

????????

????????????о????????豸???????????????????????????????????????????????????????????????????????????????????????????????????????????????MEMS????? ??????????????????????豸????????????????????????

Bio-MEMS????о???????????????

??????MEMS?????CMOS??????????????????Bio-MEMS????????????????÷??棬Teledyne DALSA?????????λ??Teledyne DALSA?????????е??????? ???-CMOS???????????????????Lab-On-Chip?????????????????????????????????????????????????????? ???????????????????????????????????????????????δ????Bio-MEMS?????????顣

?κε?????????????MEMS??????????????BioMEMS???????????????????????巋???MEMS?????????繒???????????????????????????????????????????????????????????Teledyne DALSA????CMOS/DMOS?????????????·???γ???????????ε??????????γ?????????????????????????CCD???????????????????????????/???

????MEMS????????????

??????????????????????????????????????????????г????????????????????????????????????????????????????????????????????????????Bio-MEMS??????????顣

????????????????????????????????????IMU??

MEMS?????????????????????豸????????????й?????????????????????????????????????????????????????????????ú??г??????

??Teledyne DALSA??MEMS????????????????????????????????????????????????????й????????????? ???????????DRIE??, ??????????poly thru-silicon vias??, ???????? –?????????Q???????????????????????? ???е??????CMP??????????????????????SOI????????????????????????????????????????????ASIC??MEMS????????????????販???TSV????????I/O????

??? Micromirror Fabrication

?????????????????????棬Teledyne DALSA????????????????顣???????????????????????????????????????????VOA????????????WSS??????????Щ????????????????????????????????????????????????????????????????????????????????????????￡??????????????SOI??????????SOI device layer transfer ?????????е?????bulk micromachining ????

????????????????????????侵???????????????????????????????????????????????????????????????????????????????????????

Micromirror ???????

???????

??????????????????е??????????????????г????????????????????????????????????????????в??????????????????????????????????Teledyne DALSA???CMOS???????????????????ASIC????????240V, 96 ????? DH9685 (????)?? DH9665 (???)????????????????????????????????????ASIC??????????·?????????????????????MEMS????????

4. MEMS??????: ??????????????????????

????????????MEMS????????????????????????????????????????????????????????????????????????????????????? Teledyne DALSA?? ???????????????е??????????????????????????CAD???????????????????????????????3D?????MEMS ?????????????????????????????????????????????????????????

????????????MEMS ???????????????????????? (EDA) ????????????????????????????y???????????????????????????????????????????????????????????????????????????MEMS???????????????????????飬????????????????????????????????????????????????????? ????????????????????????????????????????????????????????????????????????????????????????????????????MEMS??????????????????????????????????????

Teledyne DALSA???????ASIC?????????MEMS????????ī?????????????????????????????????????ASIC????????С?

MEMS????????е??????????????????????????????????????????????????????MEMS???????????ò??????????????????????????????????в????????ò???????????? ????????????????????????????μ???????y????????????????????κ????????????

??Teledyne DALSA??????????????????????????MEMS?????????????MEMS????????

????????????,??????????????????? Teledyne DALSA???????MEMS????????????????????????MEMS????????ASIC??????????????,????????????????????????

5??200 mm??150 mm MEMS????????

200 mm MEMS????????

Teledyne DALSA?? 8???MEMS?????????????????????????8????MEMS?????CMOS???????????????????150?????200????MEMS??????????????????????????????????????????150??????????????200?????

Lithography??????
• 5X front to front (ASML) 0.35 µm feature, 0.1 µm ????
• 5X front to back (ASML) 0.35 µm feature, 0.2 µm ????
• 1x front to front 3.0 µm feature, 0.5 µm ????
• 1x front to back 3.0 µm feature, 0.75 µm ????

Positive and negative resists ???????
• Dry film lamination of photo-definable thick polymers
• Spin coating of thin and thick photoresists and photopolymers

Plasma Deposition???????????
• PECVD TEOS, nitride.

Etching???
• DRIE (SPTS)
• RIE oxide, nitride , silicon, polysilicon, metals
• Anisotropic silicon wet etch (TMAH, KOH)
• Wet isotropic etch of oxide and aluminum
• Vacuum priming/drying, dry lift-off.

Furnaces: Vertical
• Wet/dry oxidation
• LPCVD Nitride (including low stress)
• LPCVD TEOS
• LPCVD silicon (in-situ doped)
• SAM coating

Metallization?????
• Sputter: AlCu, Au, Cr
• Electroplated : Cu, Sn, Au, Au-Sn
• Electroless plating NiPd, NiAu

Wafer Bonding???????
• Si-Si, Si-SiO2, SiO2-SiO2, eutectic, polymer
• Au-Au, Au-Sn, Al-Ge

Wafer Thinning???????
• Backgrind, edge grinding
• CMP, oxide CMP, Copper CMP

Metrology (in-line) ????
• Automated CD & alignment measurement
• White light Interferometer
• Surface profiler
• IR metrology and inspection
• Spectroscopic reflectometer
• 100% Automatic Visual Inspection

Dicing?и?
• Automated taping/dicing
• UV backing and cover tapes

Test????
• Keithley Parametric testers
• Automatic probers
• MEMS electrical, optical and acoustic testing
• Test development service for MEMS
• Customer specific test systems

150 mm MEMS????????

Teledyne DALSA ??????????????MEMS?????????????????????????????????????????????????MEMS?????????????????????????????????????????????? Teledyne DALSA???????????????????????????????ú????????????????????? ???????????MEMS????????????

Lithography??????
• 5X front to front (ASML) 0.35 µm feature, 0.15 ????
• 5X front to back (ASML) 0.35 µm feature, 0.2 µm????
• 1X front to back (EVG) 2.5 µm feature, 2 µm????
• 1X front to front (MPA) 2.5 µm feature, 1.2 µm????
• Positive and negative resists, DUV bake
• photo-definable thick polymers ??????????????
• dryfilm lamination. Dryfilm???

Plasma Deposition???????????
• PECVD oxide, TEOS, nitride, carbide

Etching???
• DRIE (SPTS)
• RIE of oxide, nitride , silicon, polysilicon, metals
• Anisotropic silicon wet etch (TMAH, KOH)
• Wet isotropic etch of oxide and aluminium
• Anhydrous HF oxide etch

Furnaces : Horizontal, Vertical
• Wet/dry oxidation
• POCL doping
• Nitride (including low stress)
• LPCVD oxide (LTO, SG/PSG, TEOS)
• LPCVD silicon (poly, amorphous, in-situ doped)
• SAM coating

Ion Implantation???????
• Low Current , High Current
• Species: B, BF2, P, As. Energy : 30 keV to 200 keV

Wafer Bonding???????
• Si-Si, Si-SiO2, glass frit, anodic, Al-Ge eutectic, polymer

Wafer Thinning???????
• Backgrind, CMP, edge grind

Metallization?????
• Sputter Al, AlCu, AlSiCu, Ti, TiN, Ge, SiCr
• CVD Tungsten
• Electroless Plating Ni/Pd, Ni/Au

Metrology (in-line) ????
• ACV4, CD-SEM, ellipsometer, interferometer
• Spectroscopic reflectometer, surfscan
• August NSX

Dicing?и?
• Automated taping/dicing
• UV backing and cover tapes

Test????
• Keithley Parametric testers
• MEMS electrical, optical and acoustic testing
• Test development service for MEMS
• Customer specific test systems

6?????????????????????

Teledyne DALSA??????????????????峧?????????????????(IDM)?????????????????????????????25??

??????????????????????????????????????滮?????????????????,??????????????????? ???????????????????????????????????????????????????????????????????????滮?????????????????????????????

??????????????????????????????? ?????????????????????棬Teledyne DALSA???? ??????????????

????????????????????????????????????????С? ??????????????????????????????????????)?????????????????????????????????????С? ??????????:

• ISO/TS 16949 ?????? ISO 9001???? ISO 14001 ???

• ?????? ESD ???????

• ?????θ???????????????

• ?????????????????

• ???????????????? (SPC)

• RoHS ???

???????

????

??????????????????

Teledyne DALSA Semiconductor

?綽: +1 450-534-2321 ???.1220

????Yang.Zou@TELEDYNEDALSA.COM

18, boul. de l'Aéroport, Bromont, QC, Canada , J2L 1S7