?????????System in Package??SiP???????????Embedded??????·?壨Printed Circuit Board??PCB???????????????豸С????????????????????????????????棬??????????????Fan-out Wafer Level Package??FoWLP???????????????販???Through Silicon Via??TSV?? 3D IC??????2.5D IC?????????????????????????????????????????????

SiP???????о???????????PCB????????????????????SiP??о??????PCB??????SiP??PCB????????????豸????????????PCB????????????о????????о???PCB??????辭??????????Pad?? ???????????ò?Re-Distribution Layer??RDL???????????????????????????PCB??????????95%??????????PCB????????PCB?????5%??覴????????м???? ??о??????????????????????

??????棬?????о?????塢PCB???I/O???????????????TSV 3D IC????????Σ??????????????????2.5D IC??????о???PCB????????н??Interposer?????????TSV????????2.5D IC???TSV 3D IC????????С??????????TSV???н???????????????????2.5D IC?????????????????FoWLP?????????????

DIGITIMES Research???FoWLP???о??????????й?????????У?Bump Array????????????????????????????????????ü??д??????????????????????????????????????δ?????????н???????? ?????????????????????????????????