??????????????о????????γ???????????????С??????о?????????????μ?????

????Yole????棬???1?ASE???????????AT&S????????????GE?????1?Shinko?????????磨Taiyo Yuden????TDK??Würth Elektronik???????????????о?????г???????????????????????????????У?ASE??TDK?????????????????????????????Texas Instruments??TI?????????????·?????????????????????о??????

????о?????????????????????????????????????????·????У?????λ???????????????????????????“????”??????

“???????”?????????????塣??????????о???????????У?????????????????????????????С???о?????о???MEMS??????????????????????side-by-side?????????л???????壨organic laminate substrate????С???Щ???????????????????via???????????????????????????????????????????е???

?1??TDK????о????????????SESUB???????TDK??Prismark??

????о??????????????????????????????д???????????????????????????С????????????????????磬TDK??????????е?????о????????????????????С????????顣????????о?????????????????????????????????????鼰????????system-in-boards??SiBs?????

?2????TDK??????У??????????????????????????У?????????????????????????300µm

ASE?????????г???????Mark Gerber???“??????????????о????????е????????????‘x’??‘y’??????????????????????????????????????????????????????????Щ????????????????????????г??????Χ????????????????????????????饗Bluetooth WiFi modules???????????????????о????????????????????????????????г????????顣”

????о?????????????????????????????????????·?壨PCB?????????????????Щ???????????????????????????????Yole??????Vivienne Hsu???????“????о??????????????????????????”

??????????????????????????????????????????????????????????Hsu????????????????????fan-out??????????????????leadframe packages?????????饗power modules??????????????????????????????

????Yole???????????о?????г?????????С??2017????2018?????г??????????1500?????????1800?????????2023?????г??????????5000???????

??????????????

????о????????????·??IC??????????е????????????IC?????????????????????????????????WLP??????弶?????

????????????????????????????г???????????????漰????????????緽?α????????????QFN???????????????QFP???????????????????????????????????????????

?3??QFN?????????????????????????

???????????????WLP??????????????漰???????fan-in??????????fan-out?????????????WLP????????????????????????WLP??????????????WLP??????????routing layers???????2????RDL?????????????????壬?????????????????????

RDL??????????·???????????WLP??????????????????????RDL???????·?塣

?4???????????????о????????????????????????Yole??

????????????????????????????????????????????????л?????????????????????????????????????????????????ɡ?????????????????????????????????surface-mount devices????CMOS??????????о???饗multi-chip module????

?л???????????????2.5D/3D?????о????????????SiP???С?????????????λ??????????л??????????????FR-4???????????FR-4?????????????????????????????Щ???????????????????????PCB?????????Щ??????л??????????????PCB???л?????????????????????????????л??????????????????????г???????赲??electromigration shield????

???????￡?IC????????·??????????????????????б?????·??????????????о???????????????????????

?????????о??????????????????????????????????????????????У????????????????????molded epoxy compound??????????????????reconstituted wafer???С?

????о?????????????Щ?????????????????С?????TDK??????????????Nigel Lim???????“IC?????????????λ???????λ?????????????????????????????????PCB????”??

Lim???“????????????????TDK????????2~3??????????????顣?????????4????壬?????????????????2????3??????????????????”

???????к?????AT&S????????????????й?Dietmar Drofenik??AT&S????з?????????Hannes Vorarberger?????“ECP?????????????У??????????????????????????????????????????????????????”AT&S??PCB????????????????????????????????????????Embedded Component Packaging ??ECP????

Drofenik??Vorarberger?????????“ECP???????黯?????????????????????????????????????????????????????о???????Ч??????????????”

????о???????о????????????????е???????????????????Ψ????TEL NEXX???????????????Cristina Chu???“??????????????????????????????????????к????????????????Щ????????????г???????????????????????????”??ASM Pacific????????TEL??????TEL NEXX????????

??????????2.5D/3D????????Щ?????????????????????IC?????????????????о???????С?????????????????SoC????????????????????????????????????????????????

??????ó????С??????????????????????????????????У????????????????SoC?????????????ν???????ɡ?

???????о???????У?

??????????????????????????????????????????о?????????????????????о????????????????90?????????????GE???????????????????????TechSearch International???Jan Vardaman???“TI??MicroSIP?????????????о?????????????????????”

????????????????2010?????????????????????????Texas Instruments??TI?????????MicroSiP?????顣????齫IC????????У???????1mm???ò???????????TI????PicoStar???????????????????У????????????????????????????

TI??????????MicroSiP??TI??Sreenivasan Koduri???“?????????????????????PicoStar?????????IC?????????/ PCB?С???·IP??PicoStar?????о??????о???????????????????λ????????????????????????????????????????????”

?5??TI MicroSiP??????????????TI??

??????????????????????????2013??GE??????г???????????Imbera??2015??ASE??TDK??????г????????????????????Yole????棬??2015???ú???????е?????о?????????????2400???????????2016???2017??????ù?????????????????????????ü????????г???????????豸?????????飩????????

????????о??????????????????????TechSearch??Vardaman???“??????????о?????????????”

????????????о???????????μ?????????Yole??Hsu???“??????????????????????????????????????????????????????????????????????????????????????ü?????????????и????????????????С??????????????????á?”

???????????????????о????????????????????????????????????Hsu???“???о???????????????????в??????????о???????????????????”

??????ü????????????????????????Siemens Business??????Mentor???????????David Wiens???“??PCB????У?????????????????????衢???????У????????С??緢????????????????????????????????????????????????????????????μ??????????С??????????????????з?????????????????????????RDL??”

???????????????????????????????????????????TDK?????????????????????壨SESUB????????о???????TDK??????SESUB?????????????С?????????????????????????

?????SESUB???????????????????????????????????????????????????????????????????

?????TDK??ASE????齨????????????????????????????ASE?????????????г????????ASE???????з??????????????????Щ???SESUB??????ASE????????????????TDK??TDK???ASE???з????

????????????????????ASE????????SESUB???????????ù??????豸????????幤????????????????????????????

???????SESUB?????У????????????м???????????????50μm??о????и??С?顣???о?????????????????????????????а弶??panel-level?????????????У?????????????????о?????????????????????????

?弶???????????????г??????з??????????????弶?????????????????????弶????о?????????????

?????????????о??????У??????????????????λ?á????????????????е?????С?ASE??Gerber???“??????????????????????????????????ü???????ò??????γ?????pad???????????????λ??????????????????·?塣”

?????????????о??????С??260~300μm??Gerber???????“??????о??У?????????????????????????????????????????????о?????????????4?????????????????????????????????????”

???????ж?????????????Gerber?????????“??????????е???TSV??3D????????????????????????и???????????????????????????????????л????????????????pad??????????????????????????????????pad????????????????躸????????????????????????copper-to-copper?????????????????????????????????????????”

??SESUB?У?????????????4?????????????????Щ?????2??5???6?????塣

?ü????????????????I/O?????????????????400??line/space??淶????????10μm??pad????80μm??pad??????120μm??Gerber???“??2018???2019??pad??????????30μm??????50μm??”

???????ASE?????????з??????“?????????????????aEASI??”??????о??????????Щ????????????У?aEASI??????????????????????????????弼?????????????????

???????

2008?????????????????????о?????????????????AT&S????????ECP?????????????

AT&S??Drofenik??Vorarberger???????“ECP????л?????????е?????????????о???????????????????????????????????????????????????????????????????????軹??????С?”

MEMS?????????????С???SESUB?????ECP???e弶???????д????Drofenik??Vorarberger???“?????????????????????裺??????????????????γ??????????????????????????????????????????????????????????????”

?6??ECP??????????????AT&S??

?????????????????????????????????????á?Drofenik??Vorarberger???“?????????????????????У??紩???豸??MEMS???????????????Я??????豸????????????????????????????????????????????IC??”

?7??ECP??????????????AT&S??

??????????η????????????????AT&S?????“??廯”??鷢???????????????????????????漰????????PCB?????????????????????????????С????顣

??????????з????????????????????????????????????????塢?????塢??????????HDI????????PCB????????Drofenik??Vorarberger???“?????SIP??SiB????????????????????????????????л???????????黯??????????????”

????о????????????????????????Щ????????????й????????????????????????????????????????????????????????????????????????????????????

?????????

??????о???????????г?????-2016?桷

???弶?????PLP?????????г?????-2018?桷

????????弼?????г????-2018?棺????о?????????????PCB?????

?????????????????RF?????????-2017?桷

??TDK??????Bluetooth???????飺SESUB-PAN-D14580??

??MEMS????г??????????????-2017?桷

??????????????-2017?桷

????????????????г?????-2017?桷

??????????????????-2017?桷

????????

2018??5??25????5??27???????????????“MEMS????????????γ?”???????????У???????????????1??MEMS?????????????????????????????????????????????2??MEMS?????????????????????????????????????????TSV???????3??MEMS??????????????????Ч????????????4??????MEMS?????????????????MEMS???硢??????????????????????????????????????????????????????崫?????????5??MEMS?????????????6?????γ??MEMS??????Tanner?????????MEMS???-???????淽??????

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E-mail??penglin@memsconsulting.com