Apple iPhone X – Infrared Dot Projector

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iPhone X?е???????????

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??2?????????淢?傷??????VCSEL??????????Broadcom?????·????????ù??????

??3??????????Folded Optical???????t??????????????·??

??4????????????????DOE????

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VCSELо?

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??????RealSense 3D????????????????????????

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Overview / Introduction
• Executive Summary
• Reverse Costing Methodology

Company Profile
• Heptagon, Lumentum
• Apple 3D Tri-Camera System
• Apple iPhone X Teardown

Physical Analysis
• Overview of the Physical Analysis
• Physical Analysis Methodology
• Dot Projector
- Dot projector views and dimensions
- Dot projector disassembly: Lenses, active DOE, NIR VCSEL, package
• Package
- View, dimensions and marking
- Cross-section
- Process characteristics
• NIR VCSEL
- Die view, dimensions and marking
- Wire bonding and cavity
- Cross-section
- Process characteristics
• Folded Optic
- View, dimensions and marking
- Disassembly and main block identification
- Lens cross-section
• Active DOE
- DOE dimensions, disassembly and main block identification, cross-section
• Comparison: Apple Dot Projector, Intel Real Sense, pmd/Infineon

Manufacturing Process Flow
• Global Overview of the Dot Projector
• NIR VCSEL Front-End Process
• NIR VCSEL Wafer Fabrication Unit
• Folded Optic Wafer Process Flow
• Folded Optic Wafer Fabrication Unit
• DOE Wafer Process Flow
• DOE Wafer Fabrication Unit
• Package Process & Assembly Unit

Cost analysis
• Overview of the Cost Analysis
• Yields Explanation and Hypotheses
• Integrated Circuit Cost
• NIR VCSEL Cost
• Folded Optic Cost
• DOE Active Cost
• Package Assembly & Test Cost
• Dot Projector Cost

Estimated Price Analysis

Company Services

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