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MEMS???????????????
2011-08-30 22:20:37   ????????   ?????0   ?????

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???μ?MEMS?????????????????????????????????????MEMS??????????????е????????????е????????SOI??Thick SOI??Thin SOI??Cavity SOI???????????????3D Integration??CMOS MEMS??

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  2000 2010 2020
MEMS die size 10 mm2 ~2-3 mm2 1-2 mm2
Packaged die size 2x5x5 mm3 QFN package (3.0 mm x 3.0 mm, height 0.9 mm) < 1x2x2 mm3
Power consumption 0.1 mW 0.05 mW < 0.05 mW
MEMS ASP ($) >$3 (3-axis) $0.7 <$0.5
Volume (Munits) 35 771 >2500
Major manufacturing evolution • 4” & 6” wafer size
• Integrated MEMS from AD
• Mostly wire bonding side by side
• 6” and 8” emerging
• SOI wafers and epiPoly Si approaches (3μ thick proof mass)
• AD shifts to hybrid
• Stacked/side by side wire bonded MEMS & ASIC
• Mostly 8” wafer size
• Capping is removed
• ASIC becomes the active capping
• 3D TSV implemented

2011????MEMS????????????????????????“???????????????????????????”??MEMS?????????????????о???????????MEMS???????????????????2020??MEMS??????????????????????????????飬???MEMS?????????????

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