- ?????????????????????????????г?????-2019?桷
- MEMS???????????γ?
- ?????????????????????????????????
- ????????????????-2018?桷
- ??????????е?LiDAR????????????????LiDAR????????
- ???MEMS?????????????????????3D??????????
- ???MEMS???????????γ?
- ??????LED???????????????????ú????????
- ???/??????2018~2019??iPhone??????????????
- 2018??MEMS?г?????127???????δ????????????????
????????TSV???????洢????????????桷
2016-10-13 15:58:42 ???????????? ?????0 ?????
TSV STACKED MEMORY Patent Landscape Analysis
???????????????
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?????????洢???????????????????г????????????????????????????????Щ??????????????????????
??????????????洢???г?
??????????????ù?????TSV????????3D???????????????????????????????????????????Ч?????????ù??????????????????????о?????????????I/O?????????????????????????????????????????????????
????????????洢???г???????????г???????????????洢???????3DS DDR4, HBM, HMC???????????ELM 3DS??????????????????????SK???????t????????????????????????????????Yole???????????3D?洢???г?????2020????????????????43%??2016??????????20????????
?????????洢????????????????
??????2014???????3DS DDR4 DRAM??2014????????4Gb ??????HBM2?洢????2016????????8Gb?????2019~2020?????????δ???????????·?????1???????????????HBM3??2??????HBM??????????????????????????????????????????????????????????SK???????2014????????2Gb??????HBM1?洢???????????δ?????????棬??????2016?????????????4Gb??????HBM2?洢???????????????8Gb?????????????????????????????á?SK??????????δ???????HBM?洢??????????????á?t??????Micron Technology??????2014?????????16Gb?????HMC?洢??????????2017?????????????HMC???????Щ?????????????????????3DS DDR4????????????????????HMC/HBM????
?????????????????????????????
δ????????????????????????????????????洢???г?????????????????????????????????????????
???????е?????????洢????????????Χ????Щ?????????????????????????????????????????????????????????????????????????????????????????????????????????漰?????????洢???????????????????90?????????ü??????????????????00?????????????????????????????????????????????????????????400????????????洢????????????????塣?????????????????????????????????????????????????????
?????????????λ
?????????洢????????????????
?????????洢??????????????????????????????????????????????????????????????????????????????????????????????????????????????????????????У????????SK???????t???????????????????????ЩС??????У?ELM 3DS?????Besang???????
??????????????????????
????????????????????????????????????????????????????????????????漰????????????????????????????
?????????5λ??????????????????t??????SK???????????????????????????????????????????г??????????????????????????????????????????????????н?????????????????????в??????????????????????????????????????????滹????ELM 3DS?????SK????????????t????????????????????????
???????????????????
???????????????????
????????????????????????????????????????????????????????????洢??????HBM??3DS DDR4??HMC ??????? NAND?洢????????????????????????
?????????????????????????漰????????洢δ????????????????????????????????洢??????????????????????????????????????????????????????????????????????????е??????????????????????
?????????????????
2014?????????????????HBM??3DS DDR4????ELM 3DS?????SK???????t??????????????????????????
???????????????????????????????????????永?????????永?????????????????????????????????ELM??????????????????????????
????????7500+ ??????壩
?????滹???????Excel???????????????з????漰???????7500+ ??????壩???????????????μ???????????????????????????????????????????????????????????????????????????????
????????
Introduction
- The Authors
- Scope of the Report
- Key Features of the Report
- Objectives of the Report
- Main Patent Assignee mentioned in the report
- Terminology for Patent Analysis
Methodology
- Patent Search, Patent Selection, Patent Analysis
- Search Equations
- Search Operators
- Segmentation of Patents
- Technological Segmentation
- Selection of Key Patents
Technology Overview
Executive Summary
Patent Landscape: TSV Stacked Memory General Overview
- For each segment:
* Time Evolution of Patent Publications
* Countries of Patent Filings
* Time Evolution by Country of Filing
* Main Patent Assignees Ranking
* Time Evolution of Patent Assignees
* Mapping of Patent Holders & Patent Applicants
* Summary of Assignee’s Patent Portfolio
* Patent Segmentation
* IP Leadership
* Citation Analysis
* Strength Index
* IP Blocking Potential
* Key Patent Families
Focus on Key Players
- For each players (Samsung,Toshiba,MicronTechnology,SKHynix,Intel):
* Technology Overview
* In-depth Patent Analysis
* Key Patents
Focus on Key Challenges
IP Litigation ELM 3DS vs. Samsung, Micron and SK Hynix
Conclusions
?????????????TSV???????洢????????????桷????????????E-mail??wangyi#memsconsulting.com??#????@????
????????????????????????-2016?桷
??????????????崫??????????????桷
??????????
???????????
- 524???????RF?????????????????????-2017?桷
- 331??iPhone X?е?ToF??????????????????????????????...
- 302??NMC?????????????????-2017?桷
- 302?????????????????
- 298??Consumer Physics???SCiO??????????????????
- 166??VCSEL?????????????-2018?桷
- 105????????崫??????????????-2018?桷
- 95??3D???????洢??NVM???????????????-2018?桷