Antenna in Package Patent Landscape 2021

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SJ Semiconductor, SMIC, TSMC, Intel, Samsung Electro Mechanics, Samsung Electronics, Huawei, Mediatek, AAC Technologies, Oppo Mobile, IBM, SPIL, Vivo Mobile, ASE, Fraunhofer, Qualcomm, Murata, Texas Instruments, NCAP, Broadcom, Powertech Technology, Sony, Fujikura, Saint Gobain, AT&S, Shanghai Xianfang Semiconductor, GlobalFoundries, Boeing, LG Electronics, CETC, Ericsson, Spreadtrum Communication, Raytheon, Bosch, Novaco Microelectronics Technologies, JCET, STATS ChipPAC, Chengdu T Ray Technology, Microsilicon Technology, Guangdong Xinhua Microelectronic Technology, Tsinghua University, TDK Epcos, New Kojinpeng Private, Hanyang University, Micron Technology, A*STAR, Core, National Chung Shan Institute of Science & Technology, Skyworks, Kyocera, Dupont Electronics, Institute of Microelectronics – Chinese Academy of Sciences, Forehope Electronic Ningbo, Dongwoo Fine-Chem, LS Mtron, Shanghai Amphenol Airwave Communication Electronics, Chunghwa Precision Test Technology, Innolux, Imec, Vega Grieshaber, Chengdu Ruishi Intelligent Technology, Nepes, Xiamen Yun Tian Semiconductor Technology, Guangdong Fozhixin Microelectronics Technology Research, Nanjing Qinheng Microelectronics, Qingdao Geer Intelligent Sensor, JCAP……

???????????????AiP????????????-2021?桷????????????E-mail??wangyi#memsconsulting.com??#????@????