Memory for Artificial Intelligence Patent Landscape Analysis 2023

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?????????????????neuromorphic computing??????????????????????????????????????????????????????е?????????????????????????????????????????????????????????????????????????????????Ч?????????????????????????????????????????????????????????У????????????????????????????洢?????????????????????????????????????洢????MRAM???????洢????PCM???????????????洢????ReRAM??????????????????????????洢????CB-RAM???????????????洢????FeRAM???????糡Ч???????FeFET??????????????

????????????????????????????￡?????????о????Knowmake???????????????μ???????????棬???????????????????????AI??/????????ML??????洢?????????????????????????????????????????Щ??????????????????????洢???????????????????ReRAM??PCM??MRAM??FRAM/FeFET??Flash??DRAM??SRAM?????

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???????????????????????????????????????????????????????????????г????2????????????????????????????????????????????м?????

???????????????????????????????????????????????????з?????????????????????????????????????technology readiness level?????????????????????????????????Χ??????????????????????????

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??????????????洢?????????????·??IC????洢??????????????????з?????????з????????ζ??????????????з?????????????????????????????????????????????????о?????????????????????2015?????ɡ?

??????????????????й??????????л???????????????????????????????????????幫???IBM???????????????????λ????ò????Applied Materials????????磨TSMC??????о??GlobalFoundries????TetraMem??ICLeague?????????????????????????????????????????δ???????????????

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???????????????????Щ????????????????????磺????????????洢??????ReRAM??PCM??MRAM???????????羧??????????洢??????FRAM/FeFET????????洢??????Flash??DRAM??SRAM????????????洢??????????????????????2D??1D????????????????????????????????????л??????洢?????????

?????滹?????????????????洢????????????FRAM????????????????????RRAM??????????????????????????????????

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?????????????8???????????????????????洢???????????????????????IBM???????Samsung??????ò????TDK??SK???????SK Hynix????????????Macronix?????????HP?????TetraMem??????Щ??????????????????????????????????????????????????????????????????????????????????????????????????????????Ч???????????????????

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????????????????Excel???????????а??????о?????????1300???????塣????????????????????μ????????????????????????????????????????????????????????????????????????????????????????RRAM??PCM??MRAM??FeRAM/FeFET??Flash??DRAM??SRAM??????????

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?? ????Excel?????????????????з??????????????>1300??????壩?????????????????????????μ??????????

?????о??漰??????????

????磺IBM, Samsung, HP, TDK, Micron, SK Hynix, Macronix, Intel, TetraMem, GlobalFoundries, Fujitsu, Thales, Panasonic, Sony, Toshiba/Kioxia, Applied Materials, Winbond Electronics, Honeywell, Monolithic 3D, Qualcomm, TSMC, Gyrfalcon, I & F, ICLeague, Merck, NTT, Olympus, Rohm, HRL Labs, Semron, Synopsys, Texas Instruments, Western Digital, Crossbar, Weeebit, Nantero…

????磺Huazhong University of Science and Technology, Peking University, Nanjing University of Posts & Telecommunications (NJUPT), Hanyang University, Seoul National University (SNU), Pohang University of Science and Technology (POSTECH), Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), Korea Advanced Institute of Science and Technology, Ningbo Institute of Materials Technology & Engineering (NIMTE), Tsinghua University, CNRS – French National Research Center, Fudan University, Nanjing University, University of Electronic Science and Technology of China (UESTC), Hebei University, Beihang University, Fuzhou University, University of Nankai (NKU), Shandong University of Science and Technology, Sungkyunkwan University, Kookmin University, California Institute of Technology (Caltech), Harvard University, CEA – French Alternative Energies and Atomic Energy Commission…

???????????????????洢??????????????-2023?桷????????????E-mail??wangyi#memsconsulting.com??#????@????